SEM silicon wafer substrates, Type P, 111

These silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The wafer is shipped in a wafer carrier.

Properties:

  • Orientation: <111> or <100> for 127mm wafer
  • Resistance: 1-30 Ohms
  • Type P: (Boron) (1 primary flat)
  • No SiO2 top coating
  • Wafer thickness:
    • 25.4mm diameter = 10 - 12 mill (254 - 304µm)
    • 50.8mm diameter = 9 - 13 mill (230-330um)
    • 76.2mm diameter = 13.6 - 18.5 mill (345-470um)
    • 101.6mm diameter = 18.7 - 22.6 mill (475-575um)
    • 127mm diameter = 23.6 - 25.2 mill (600-690um)
  • Roughness: 2nm
  • TTV: = <20um
  • Wafer is polished on one side
Code Title Size Pack Size Availability Price Updated: 29-01-2022
PEL16011 SEM silicon wafer substrates, Type P, 111 25.4mm Each 2 weeks AU $96.00
GAS04 SEM silicon wafer substrates, Type P, 111 101.6mm Each 1 in stock AU $99.00
GAS02 SEM silicon wafer substrates, Type P, 111 50.8mm Each 2 weeks AU $68.00
GAS03 SEM silicon wafer substrates, Type P, 111 76.2mm Each 2 weeks AU $71.00
GAS06 SEM silicon wafer substrates, Type P, 111 127mm Each 2 weeks AU $137.00