Silicon wafer, Type P, 111

These 2", 3", 4" and 6" diameter silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers (T421). The wafer is shipped in a wafer carrier (H270-025).

Properties:

  • Orientation: <111> or <100> for 6 in. wafer
  • Resistance: 1-30 Ohms
  • Type P: (Boron) (1 primary flat)
  • No SiO2 top coating
  • Wafer thickness:
    • dia. 2 in. = 9 - 13 mill (230-330um)
    • dia. 3 in. = 13.6 - 18.5 mill (345-470um)
    • dia. 4 in. = 18.7 - 22.6 mill (475-575um)
    • dia. 6 in. = 23.6 - 25.2 mill (600-690um)
  • Roughness: 2nm
  • TTV: = <20um
  • Wafer is polished on one side
Code Title Size Pack Size Availability Price
GAS04 Silicon wafer, Type P, 111 dia. 4" each Only 3 AU $97.00
GAS06 Silicon wafer, Type P, 111 dia. 6" each 2 weeks AU $131.00
GAS02 Silicon wafer, Type P, 111 dia. 2" each 2 weeks AU $65.00
GAS03 Silicon wafer, Type P, 111 dia. 3" each 2 weeks AU $68.00
Code Title Size Pack Size Availability Price
GAS04 Silicon wafer, Type P, 111 dia. 4" each Only 3 AU $97.00
GAS06 Silicon wafer, Type P, 111 dia. 6" each 2 weeks AU $131.00
GAS02 Silicon wafer, Type P, 111 dia. 2" each 2 weeks AU $65.00
GAS03 Silicon wafer, Type P, 111 dia. 3" each 2 weeks AU $68.00