Plasma asher unit with RF generator

The K1050X Plasma Treatment Unit consists of a solid state RF generator and associated tuning circuits, dual process gas flow monitoring needle valve control and full or restricted vent control.It has a cylindrical chamber with a rack out drawer system for ease of sample loading.The vacuum system is a dual stage separate rotary vacuum pump or optional turbo pump backed by diaphragm pump.The rack out drawer system can be exchanged for a vacuum loading port, for special cleaning applications in SEM/TEM.This usually employs an oxygen/argon mix of gases, the oxygen removing the organic material (hydrocarbons) and the argon giving a surface etching of the sample.Applications:Asbestos sample preparationMicro-incineration of organic materialEtching of organic samples for SEM and TEM workRemoval of Photo-resist and electronic component encapsulationsSurface treatment of plasticsCleanin...

The K1050X Plasma Treatment Unit consists of a solid state RF generator and associated tuning circuits, dual process gas flow monitoring needle valve control and full or restricted vent control.
It has a cylindrical chamber with a rack out drawer system for ease of sample loading.
The vacuum system is a dual stage separate rotary vacuum pump or optional turbo pump backed by diaphragm pump.
The rack out drawer system can be exchanged for a vacuum loading port, for special cleaning applications in SEM/TEM.
This usually employs an oxygen/argon mix of gases, the oxygen removing the organic material (hydrocarbons) and the argon giving a surface etching of the sample.

Applications:

  • Asbestos sample preparation
  • Micro-incineration of organic material
  • Etching of organic samples for SEM and TEM work
  • Removal of Photo-resist and electronic component encapsulations
  • Surface treatment of plastics
  • Cleaning of SEM/TEM sample holders

Features:

  • Solid state RF generator and associated tuning circuits
  • Fully automatic control
  • Rack out drawer
  • Dual process gas flow
  • Compact bench-top system

Advantages:

  • Low temperature ashing process
  • Easy to operate
  • Easy loading/removal of samples
  • Can select a mixture of gases
  • Space saving

Specification of the K1050X Plasma Unit:

  • Instrument case: 450 mm W x 350 mm D x 300 mm H.
  • Barrel work chamber: 'Pyrex' 160 mm L x 110 mm dia. (Borosilicate Glass as standard.)
  • Rack out drawer: Sliding draw assembly with sample holder tray.
  • Plasma output: RF power supply - Solid state 150 Watt RF peak, normal operating range 25 to 75 Watt @ 13.56 mhz.
  • (Note: The frequency used is that allocated by the International Standards CISPR as an allowed 'industrial' frequency.)
  • Vacuum gauge: active gauge head with fully operating vacuum range display (ATM to 1 x 10-5 mbar. Full scale - normal operating vacuum 0.5 mbar to 1.0 mbar)
  • Digital timer unit: Displays elapsed time with range select: 99.9 Hours. Automatic termination of ashing process.
  • Dual gas flow gauges: Dual gas needle valve flow control, selectable for 1 or 2 or both gasses (calibrated 5 to 100 cm3/minute Air @ A.T.P.)
  • Weight: 25 kg.
  • Supply: 230 Volts 50 Hz (5 amp max. including. pump)
  • Services: Process gas at nominal 5 psi, (0.33 bar)
  • Recommended vacuum pump: No. 3 pump (with a synthetic oil 'Fomblin' for oxygen or corrosive process gases.) 2 m3/Hr

Optional Accessories

  • EK3170 - Diaphragm pump MD1 23 L/M
  • Fomblinised rotary pump - see page V4 and K6
  • EK3171 - XDS5 Scroll pump (oil free)
Code Title Style Pack Size Availability Price
K1050X Plasma asher unit with RF generator Standard each 10 weeks Quote only Quote
K1050XT Plasma asher unit with RF generator Turbo pump each 10 weeks Quote only Quote
Code Title Style Pack Size Availability Price
K1050X Plasma asher unit with RF generator Standard each 10 weeks Quote only Quote
K1050XT Plasma asher unit with RF generator Turbo pump each 10 weeks Quote only Quote