Plasma asher unit with RF generator

The K1050X Plasma Treatment Unit consists of a solid state RF generator and associated tuning circuits, dual process gas flow monitoring needle valve control and full or restricted vent control.It has a cylindrical chamber with a rack out drawer system for ease of sample loading.The vacuum system is a dual stage separate rotary vacuum pump or optional turbo pump backed by diaphragm pump.The rack out drawer system can be exchanged for a vacuum loading port, for special cleaning applications in SEM/TEM.This usually employs an oxygen/argon mix of gases, the oxygen removing the organic material (hydrocarbons) and the argon giving a surface etching of the sample.Applications:Asbestos sample preparationMicro-incineration of organic materialEtching of organic samples for SEM and TEM workRemoval of Photo-resist and electronic component encapsulationsSurface treatment of plasticsCleanin...

The K1050X Plasma Treatment Unit consists of a solid state RF generator and associated tuning circuits, dual process gas flow monitoring needle valve control and full or restricted vent control.
It has a cylindrical chamber with a rack out drawer system for ease of sample loading.
The vacuum system is a dual stage separate rotary vacuum pump or optional turbo pump backed by diaphragm pump.
The rack out drawer system can be exchanged for a vacuum loading port, for special cleaning applications in SEM/TEM.
This usually employs an oxygen/argon mix of gases, the oxygen removing the organic material (hydrocarbons) and the argon giving a surface etching of the sample.

Applications:

  • Asbestos sample preparation
  • Micro-incineration of organic material
  • Etching of organic samples for SEM and TEM work
  • Removal of Photo-resist and electronic component encapsulations
  • Surface treatment of plastics
  • Cleaning of SEM/TEM sample holders

Features:

  • Solid state RF generator and associated tuning circuits
  • Fully automatic control
  • Rack out drawer
  • Dual process gas flow
  • Compact bench-top system

Advantages:

  • Low temperature ashing process
  • Easy to operate
  • Easy loading/removal of samples
  • Can select a mixture of gases
  • Space saving

Specification of the K1050X Plasma Unit:

  • Instrument case: 450 mm W x 350 mm D x 300 mm H.
  • Barrel work chamber: 'Pyrex' 160 mm L x 110 mm dia. (Borosilicate Glass as standard.)
  • Rack out drawer: Sliding draw assembly with sample holder tray.
  • Plasma output: RF power supply - Solid state 150 Watt RF peak, normal operating range 25 to 75 Watt @ 13.56 mhz.
  • (Note: The frequency used is that allocated by the International Standards CISPR as an allowed 'industrial' frequency.)
  • Vacuum gauge: active gauge head with fully operating vacuum range display (ATM to 1 x 10-5 mbar. Full scale - normal operating vacuum 0.5 mbar to 1.0 mbar)
  • Digital timer unit: Displays elapsed time with range select: 99.9 Hours. Automatic termination of ashing process.
  • Dual gas flow gauges: Dual gas needle valve flow control, selectable for 1 or 2 or both gasses (calibrated 5 to 100 cm3/minute Air @ A.T.P.)
  • Weight: 25 kg.
  • Supply: 230 Volts 50 Hz (5 amp max. including. pump)
  • Services: Process gas at nominal 5 psi, (0.33 bar)
  • Recommended vacuum pump: No. 3 pump (with a synthetic oil 'Fomblin' for oxygen or corrosive process gases.) 2 m3/Hr

Optional Accessories

  • EK3170 - Diaphragm pump MD1 23 L/M
  • Fomblinised rotary pump - see page V4 and K6
  • EK3171 - XDS5 Scroll pump (oil free)
Code Title Style Pack Size Availability Price Updated: 30-11-2021
K1050X Plasma asher unit with RF generator Standard each 10 weeks Quote only Quote
K1050XT Plasma asher unit with RF generator Turbo pump each 10 weeks Quote only Quote