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Prices are current as of Sunday, 20/09/2020.
Prices shown are in AUD and GST exclusive. Tax is added at checkout.

AU $143.00
Availability: Backorder
Product Code: GAS06

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These 2", 3", 4" and 6" diameter silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers (T421). The wafer is shipped in a wafer carrier (H270-025).


  • Orientation: <111> or <100> for 6 in. wafer
  • Resistance: 1-30 Ohms
  • Type P: (Boron) (1 primary flat)
  • No SiO2 top coating
  • Wafer thickness:
    • dia. 2 in. = 9 - 13 mill (230-330um)
    • dia. 3 in. = 13.6 - 18.5 mill (345-470um)
    • dia. 4 in. = 18.7 - 22.6 mill (475-575um)
    • dia. 6 in. = 23.6 - 25.2 mill (600-690um)
  • Roughness: 2nm
  • TTV: = <20um
  • Wafer is polished on one side


Orders with items in stock are packed within 24 hours. We ship with our best choice of courier, depending on goods ordered and shipping address provided.


Standard delivery

Express delivery


Next day



2-3 business days



4-10 business days

2-3 business days


6-14 business days

2-3 business days



5-14 business days

*Note: Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers' control.

Standard shipping is $15 in Australia (free on orders over $200). Add $5 to ship Express (under 2kg only)


Order online and collect from our warehouse in Townsville.


Freight Charge

Ready for collection

11 Carlton Street, Kirwan


Once invoice has been emailed
(Less than 1 business day)

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