The wafer mounted on the plastic film can then be held down using a vacuum manifold or mechanical means for dicing or scribing. After dicing or scribing, the parts can be separated from the wafer-mount 559 film by washing in acetone or MEK. Ideal for holding down silicon wafers, alumina, or glass substrates for scribing. The substrate is positioned on the film and pressed down firmly so that it adheres to the plastic film. No heating is required.
Available in sheet form 254 x 254mm. To use, remove the paper backing exposing the adhesive layer.