Silver conductive epoxy

Strong, highly conductive epoxy for solderless connections and repairs of circuit boards, static discharge shielding, grounding and conductive paths.

Cure Schedule (Minimum bond temperature/time)
65 to 121 deg. C (150 to 250 deg. F) for 5 to 10 min.
25 deg. C (75 deg. F) for 4 hours

Properties:

• Bonding surface mount components
• High strength conductive bonds
• Quick, low or no heat cure - air dries
• Rework or remove with hot soldering iron
• Excellent electrical conductivity
• 2-part epoxy, reusable applicator with stir stick, 7g each

Service temperature range -91 deg. C to 100 deg. C (-132 deg. F to 212 deg. F) permanent bond. 0.4 ohms/sq/mil (25um)