MicroSaw is a lightweight, portable diamond wheel saw that can be placed under a standard microscope of the laboratory. The precision offered by such an optical arrangement makes MicroSaw perfect during the preparation of the TEM specimen for slicing and sectioning. The design and simple operation allows a person to cut nearly all solid material accurately and reproducibly for TEM before thinning. More sectioning of thin ceramic, semiconductor materials, hard metals can be processed with a precision of 0.01 mm!
The Model MS3 MicroSaw is powered through a helical transmission by an electric motor. The power supply sub unit supplies the 12V DC. The velocity at which the wheel turns can be changed repeatedly. It is possible to adjust the position of the specimen, the contact point of the arm, the tension of the arm and the control down-stop mechanism. Two adjustment screws at the bottom of the instrument enable the stand to be positioned and the MicroSaw for accuracy sectioning under the stereomicroscopy to be levelled.
|Input power||12 VDC|
|Dimensions||260 mm x 150 mm x 80 mm|
|Diamond wheel size||50mm diameter, 0.15mm thick|
|Diamond wheel type||AC32 63/50|
|Maximum Sample Size||~ 10 x 10 mm|
|Minimum slice thickness||~ 100 microns|
- Switching power supply 100 – 240 VAC, 50/60 Hz
- MicroSaw Model MS3 with 1 diamond wheel (#55150-10)