Diamond knife, Ultra ATS, 35 deg. 3.0mm

The Ultra ATS Diamond knife is perfect for placing sections on Si wafers to view under the SEM. The knife comes in 3.0mm size with 35° angle. Please see the technical data sheet for an illustration showing the technique of placing sections on a wafer.

Technical data sheet

Code Title Length Condition Pack Size Availability Price
DIA30-UL-ATS Diamond knife, Ultra ATS, 35 deg. 3.0mm 3.0mm New each 6 weeks Quote only Quote
Code Title Length Condition Pack Size Availability Price
DIA30-UL-ATS Diamond knife, Ultra ATS, 35 deg. 3.0mm 3.0mm New each 6 weeks Quote only Quote