ULTRAPOL advanced lapping and polishing system
ULTRAPOL advanced lapping and polishing system
ULTRAPOL Advance was developed to work as an all-in-one lapping & polishing workstation for flat surface development. Advance's unbeatable mix of advanced features and process technologies allows new IC generations to be processed accurately.
Applications:
- Topside electronic de-processing - enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR
- Backside preparation of packages and wafers, particularly for flip-chips - and rapid global thinning of larger surfaces
- Cross-sectioning of die and package-level devices
Along with its signature quick release interface and work holder technologies, ULTRAPOL advance offers completely new designs for sample loading, oscillation and tilt alignment.
Fast and convenient sample movement between polisher & microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die -- a huge improvement over earlier generation polishers.
The system allows recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a 'Power Polish' mode is incorporated that rotates the sample during processing.
Features:
- Fast & repeatable alignment - precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis provide for optical alignment that does not wander.
- Slurry polishing - A recirculating pump may be added, in addition to the standard coolant system. Slurries are held within a drip tray for easy disposal, or re-use.
- Avoids cross-contamination - The unique slurry / drip tray concept allows convenient removal and cleaning of all items that come into contact with abrasives and polishing media
- Better delayering results - The ULTRACOLLIMATOR option allows for improved parallelism, improving the 'sweet spot' of the delayered surface
The use of optical alignment allows for simpler faster and significantly more accurate alignment to be achieved on a range of sample types and applications including: Crystal polishing, Double side wafer polishing, Topside de-processing of layers of metal circuitry for electronic failure analysis and competitive analyses, Backside polishing of packaged computer dice for 'through silicon' microscopy.
ULTRAPOL Advance Polishing System includes: Base unit with timer, oscillator, speed control (50 to 400rpm), 200mm Polishing plate Sample Z-direction control with 1µm precision Mechanical alignment indicator 2 circle tilt control (±2°) Sample Rotation control Quick release interface mounting system 2 sample mounting plates and start-up accessory kit sample load control - 0 to 3kg (in 50g increments) Drip Tray / Slurry Containment Tray.
Our upgraded patented ULTRACOLLIMATOR technology allows for fast accurate and repeatable parallel alignment of surfaces to the polisher. Since the collimator beam optically aligns directly to the die, there is no guesswork or the need to use mechanical indicators. Alignment is constantly monitored during polishing. Transfer to-and-from the microscope is made fast and accurate. Any small realignments can be made quickly and accurately.
ULTRACOLLIMATOR modules allow the user to produce the finest results of sample parallelism with both flat lapping and selected area preparation machines. The units produce a 'single box' solution, incorporating an LCD screen and all the controls required to align the sample.
Images are illustrative only. Please check product details before ordering.
