ETC epoxy adhesives
ETC epoxy adhesives
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Electrally/Thermally Conductive (ETC) epoxy adhesives provide solutions to a variety of electrical, electronic, and thermal design problems throughout the laboratories and industries.
Properties Electrically/Thermally Conductive
|Mix Ratio by Weight: Resin : Hardener||NA||1:1||NA||NA||1:1||100:12||1:1|
|Mixes Specific Gravity, g/cc @ 25?C||1.85||2.8||2.3/2.1||2.87/1.5||0.85||1.66||1.9|
|Mixes Viscosity, @ 25?C, cps||Paste||Paste||Paste/Paste||Paste/480||Paste||85,000||Paste|
|Pot Life, 100g mass @ 25?C, hrs.||N/A||1||N/A||N/A||4.0||?1.0
|Recommended Cure, hr/?F||2/300||24/RT||2/RT+2/200||2RT+2/200||2/200||2/100+2/200
|Alternative Cure, hr/?F||6/250||4/170 or 2/210||--||--||24-48/RT||24-48/RT
|Temperature Resistance, ?F (?C)||340 (171)||340 (171)||1200 (649)||1000 (538)||400 (204||572 (300)||400 (204)|
|CTE, in/in/?F x 106 (?C)||29.0 (52.2)||13.9 (25.0)||9.6 (17.3)||6.5 (11.7)||33.0 (60.0)||25.0 (45.0)||18.7 (33.3)|
|Thermal Conductivity, Btu-in/hr-ft2-?F||62.2||65.0||63.1||17.9||9.0||12.5||8.5|
|Tensile Shear Strength, psi *||2,500||1,500||--||--||1,400||1,200||1,375|
|Volume Resistivity, ohm-cm||0.01||0.0052||0.0002||0.005||1.0 x 105||1.0 x 1014||1.0 x 1014|
|Dielectric Strength, volts/mil||?||?||?||?||80||50||250|
Store at room temperature
Surface Preparation: All surfaces must be free of oil, dirt, corrosives, oxides, paint or other foreign matter.
Mixing: Two-component products should be mixed thoroughly to a uniform consistency. Preheat high viscosity epoxies to approximately 125?F to facilitate pouring and mixing.
Application: In most cases, the adhesive should be applied to both surfaces maintaining a glue line of less than 10 mils (25.4 ?m). After assembling the parts, pressure should be applied to the assembly to prevent warpage and reduce air entrapment. Refer to curing guidelines in above property chart.
ETC Bond 525 ? Electrically conductive, silver filled, one-part epoxy paste. Good chemical resistance and mechanical strength to 340?F. SDS
ETC Bond 597A ? Electrically and thermally conductive. Silver filled. One part system. Inorganic system for bonding applications up to 1200?F.
ETC Bond 598FS ? Electrically and thermally conductive. Nickel filled. One part system. Low viscosity. For applications up to 1000?F. SDS